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• Cover
• Half-Title Page
• Title Page
• Copyright Page
• Dedication
• Table of Contents
• Preface
• About the Author
• Chapter 1 Introduction
• 1.1 Semiconductor Technology Trends
• 1.2 Temperature-Dependent Failures
• 1.2.1 Temperature-Dependent Mechanical Failures
• 1.2.2 Temperature-Dependent Corrosion Failures
• 1.2.3 Temperature-Dependent Electrical Failures
• 1.3 Importance of Heat Transfer in Electronics
• 1.4 Thermal Design Process
• References
• Chapter 2 Energy, Energy Transfer, and Heat Transfer
• 2.1 Energy and Work
• 2.2 Macroscopic and Microscopic Energies
• 2.3 Energy Transfer and Heat Transfer
• 2.4 Equation of State
• Problems
• References
• Chapter 3 Principle of Conservation of Energy
• 3.1 First Law of Thermodynamics
• 3.2 Energy Balance for a Control Mass
• 3.3 Energy Balance for a Control Volume
• Problems
• References
• Chapter 4 Heat Transfer Mechanisms
• 4.1 Conduction Heat Transfer
• 4.2 Convection Heat Transfer
• 4.2.1 Simplified Correlations For Convection Heat Transfer in Air
• 4.3 Radiation Heat Transfer
• Problems
• References
• Chapter 5 Thermal Resistance Network
• 5.1 Thermal Resistance Concept
• 5.2 Series Thermal Layers
• 5.3 Parallel Thermal Layers
• 5.4 General Resistance Network
• 5.5 Thermal Contact Resistance
• 5.6 Thermal Interface Materials
• 5.7 Spreading Thermal Resistance
• 5.8 Thermal Resistance of Printed Circuit Boards (Pcbs)
• Problems
• References
• Chapter 6 Thermal Specification of Microelectronic Packages
• 6.1 Importance of Packaging
• 6.2 Packaging Types
• 6.3 Thermal Specifications of Microelectronic Packages
• 6.3.1 Junction-To-Air Thermal Resistance
• 6.3.2 Junction-To-Case and Junction-To-Board Thermal Resistances
• 6.3.3 Package Thermal Characterization Parameters
• 6.4 Package Thermal Resistance Network
• 6.5 Parameters Affecting Thermal Characteristics of a Package
• 6.5.1 Package Size
• 6.5.2 Packaging Material
• 6.5.3 Die Size
• 6.5.4 Device Power Dissipation
• 6.5.5 Air Velocity
• 6.5.6 Board Size and Thermal Conductivity
• Problems
• References
• Chapter 7 Fins and Heat Sinks
• 7.1 Fin Equation
• 7.1.1 Infinitely Long Fin
• 7.1.2 Adiabatic Fin Tip
• 7.1.3 Convection and Radiation from Fin Tip
• 7.1.4 Constant Temperature Fin Tip
• 7.2 Fin Thermal Resistance, Effectiveness, and Efficiency
• 7.3 Fins With Variable Cross Sections
• 7.4 Heat Sink Thermal Resistance, Effectiveness, and Efficiency
• 7.5 Heat Sink Manufacturing Processes
• Problems
• References
• Chapter 8 Heat Conduction Equation
• 8.1 One-Dimensional Heat Conduction Equation for a Plane Wall
• 8.2 General Heat Conduction Equation
• 8.3 Boundary and Initial Conditions
• 8.3.1 Temperature Boundary Condition
• 8.3.2 Heat Flux Boundary Condition
• 8.3.3 Convection Boundary Condition
• 8.3.4 Radiation Boundary Condition
• 8.3.5 General Boundary Condition
• 8.3.6 Interface Boundary Condition
• 8.4 Steady-State Heat Conduction
• 8.4.1 One-Dimensional, Steady-State Heat Conduction
• 8.4.2 Two-Dimensional, Steady-State Heat Conduction
• 8.5 Transient Heat Conduction
• 8.6 Lumped Systems
• 8.6.1 Simple Lumped System Analysis
• 8.6.2 General Lumped System Analysis
• 8.6.3 Validity of Lumped System Analysis
• Problems
• References
• Chapter 9 Fundamentals of Convection Heat Transfer
• 9.1 Type of Flows
• 9.1.1 External and Internal Flows
• 9.1.2 Forced and Natural Convection Flows
• 9.1.3 Laminar and Turbulent Flows
• 9.1.4 Steady-State and Transient Flows
• 9.2 Viscous Force, Velocity Boundary Layer, and Friction Coefficient
• 9.3 Temperature Boundary Layer and Convection Heat Transfer Coefficient
• 9.4 Conservation Equations
• 9.5 Boundary Layer Equations
• References
• Chapter 10 Forced Convection Heat Transfer: External Flows
• 10.1 Normalized Boundary Layer Equations
• 10.2 Reynolds Number, Prandtl Number, Eckert Number, and Nusselt Number
• 10.3 Functional Forms of Friction Coefficient and Convection Heat Transfer Coefficient
• 10.4 Flow Over Flat Plates
• 10.4.1 Laminar Flow Over a Flat Plate With Constant Temperature
• 10.4.2 Turbulent Flow Over a Flat Plate With Uniform Temperature
• 10.4.3 Flow Over a Flat Plate With Uniform Surface Heat Flux
• 10.5 Flow Across Cylinders
• 10.6 Cylindrical Pin-Fin Heat Sink
• 10.7 Procedure For Solving External Forced Convection Problems
• Problems
• References
• Chapter 11 Forced Convection Heat Transfer: Internal Flows
• 11.1 Mean Velocity and Mean Temperature
• 11.2 Laminar and Turbulent Pipe Flows
• 11.3 Entry Length and Fully Developed Flow
• 11.4 Pumping Power and Convection Heat Transfer in Internal Flows
• 11.5 Velocity Profiles and Friction Factor Correlations
• 11.6 Temperature Profiles and Convection Heat Transfer Correlations
• 11.7 Fans and Pumps
• 11.7.1 Types of Fans
• 11.7.2 Fan Curve and System Impedance Curve
• 11.7.3 Fan Selection
• 11.7.4 Types of Pumps
• 11.8 Plate-Fin Heat Sinks
• Problems
• References
• Chapter 12 Natural Convection Heat Transfer
• 12.1 Buoyancy Force and Natural Convection Flows
• 12.2 Natural Convection Velocity and Temperature Boundary Layers
• 12.3 Normalized Natural Convection Boundary Layer Equations
• 12.3.1 Grashof and Rayleigh Numbers
• 12.3.2 Functional form of the Convection Heat Transfer Coefficient
• 12.4 Laminar and Turbulent Natural Convection Over a Vertical Flat Plate
• 12.5 Natural Convection Around Inclined and Horizontal Plates
• 12.6 Natural Convection Around Vertical and Horizontal Cylinders
• 12.7 Natural Convection in Enclosures
• 12.8 Natural Convection from Array of Vertical Plates
• 12.9 Mixed Convection
• Problems
• References
• Chapter 13 Radiation Heat Transfer
• 13.1 Radiation Intensity and Emissive Power
• 13.2 Blackbody Radiation
• 13.3 Radiation Properties of Surfaces
• 13.3.1 Surface Emissivity
• 13.3.2 Surface Absorptivity
• 13.3.3 Surface Reflectivity
• 13.3.4 Surface Transmissivity
• 13.3.5 Kirchhoff’S Law
• 13.4 Solar and Atmospheric Radiations
• 13.5 Radiosity
• 13.6 View Factors
• 13.7 Radiation Heat Transfer Between Black Bodies
• 13.8 Radiation Heat Transfer Between Nonblack Bodies
• 13.9 Radiation Heat Transfer from a Plate-Fin Heat Sink
• Problems
• References
• Chapter 14 Computer Simulations and Thermal Design
• 14.1 Heat Transfer and Fluid Flow Equations: a Summary
• 14.2 Fundamentals of Computer Simulation
• 14.2.1 Steady-State, One-Dimensional Heat Conduction
• 14.2.2 Steady-State, Two-Dimensional Heat Conduction
• 14.2.3 Transient Heat Conduction
• 14.2.4 Fluid Flow and Energy Equations
• 14.3 Turbulent Flows
• 14.4 Solution of Finite-Difference Equations
• 14.5 Commercial Thermal Simulation Tools
• 14.5.1 Creating the Thermal Model
• 14.5.2 Creating the Mesh
• 14.5.3 Solving Flow and Temperature Equations
• 14.5.4 Review the Results
• 14.5.5 Presenting the Results
• 14.6 Importance of Modeling and Simulation in Thermal Design
• References
• Chapter 15 Experimental Techniques and Thermal Design
• 15.1 Flow Rate Measurement Techniques
• 15.2 System Impedance Measurement
• 15.3 Fan and Pump Curve Measurements
• 15.4 Velocity Measurement Methods
• 15.5 Temperature Measurement Techniques
• 15.6 Acoustic Noise Measurements
• 15.7 Importance of Experimental Measurements in Thermal Design
• References
• Chapter 16 Advanced Cooling Technologies
• 16.1 Heat Pipes
• 16.1.1 Capillary Limit
• 16.1.2 Boiling Limit
• 16.1.3 Sonic Limit
• 16.1.4 Entrapment Limit
• 16.1.5 Other Heat Pipe Performance Limits
• 16.1.6 Heat Pipe Applications in Electronic Cooling
• 16.1.7 Heat Pipe Selection and Modeling
• 16.1.8 Thermosyphons, Loop Heat Pipes, and Vapor Chambers
• 16.2 Liquid Cooling
• 16.3 Thermoelectric Coolers
• 16.4 Electrohydrodynamic Flow
• 16.5 Synthetic Jet
• References
• Appendix: Tables of Material Properties
• References
• Index