Efnisyfirlit

• Cover
• Half Title
• Title Page
• Copyright Page
• Table of Contents
• Preface
• 1 What is mechatronics?
• 1.1 Mechatronics in manufacturing
• 1.2 Mechatronics in products
• 1.3 Mechatronics and engineering design
• 1.3.1 A modular approach to mechatronics and engineering design
• 1.4 The engineer and mechatronics
• 1.5 Mechatronics and technology
• Part One Sensors and Transducers
• 2 Measurement systems
• 2.1 Sensors, transducers and measurement
• 2.2 Classification
• 2.2.1 Classification by function
• 2.2.2 Classification by performance
• 2.2.3 Classification by output
• 2.3 Developments in transducer technology
• 2.3.1 Solid state transducers
• 2.3.2 Optical transducers
• 2.3.3 Piezoelectric transducers
• 2.3.4 Ultrasonic transducers
• 2.4 Signal processing and information management
• 2.5 The design of a measurement system
• 3 Resistive, capacitive, inductive and resonant transducers
• 3.1 Resistive transducers
• 3.1.1 Potentiometers
• 3.1.2 Strain gauges
• 3.1.3 Resistive temperature transducers
• 3.2 Capacitive transducers
• 3.3 Inductive transducers
• 3.3.1 Linear variable differential transformer
• 3.3.2 Linear variable inductive transducer
• 3.3.3 The inductosyn
• 3.3.4 Inductive velocity transducers
• 3.4 Thermoelectric transducers
• 3.5 Resonant transducers
• 3.5.1 Vibrating wire transducers
• 3.5.2 Vibrating beam transducers
• 3.5.3 Vibrating cylinder transducers
• 4 Optical measurement systems
• 4.1 Radiant energy sources
• 4.1.1 Incandescent lamps
• 4.1.2 Discharge lamps
• 4.1.3 Light emitting diodes
• 4.1.4 Lasers
• 4.1.5 Illumination
• 4.2 Photodetectors
• 4.2.1 Thermal photodetectors
• 4.2.2 Quantum photodetectors
• 4.2.3 Array detectors
• 4.3 Vision systems
• 4.3.1 Image processing
• 4.4 Laser scanning
• 4.5 Fibre optic transducers
• 4.5.1 Intensity modulation
• 4.5.2 Phase modulation
• 4.5.3 Modulation of the angle of polarization
• 4.5.4 Modulation of wavelength and spectral distribution
• 4.6 Non-fibre optical transducers
• 4.6.1 Optical encoders
• 4.6.2 Tactile sensing
• 4.6.3 Triangulation
• 5 Solid state sensors and transducers
• 5.1 Magnetic measurements
• 5.1.1 Hall effect
• 5.1.2 Magnetoresistor
• 5.1.3 Magnetodiode
• 5.1.4 Magnetotransistor
• 5.2 Temperature measurements
• 5.2.1 Thermistor
• 5.2.2 Thermodiodes and thermotransistors
• 5.2.3 Seebeck effect devices
• 5.2.4 Solid state pyrometers
• 5.3 Mechanical measurements
• 5.3.1 Strain
• 5.3.2 Force
• 5.4 Chemical measurements
• 5.4.1 Humidity
• 5.4.2 Gas detectors
• 6 Piezoelectric and ultrasonic sensors and transducers
• 6.1 Piezoelectric devices
• 6.1.1 Accelerometers
• 6.1.2 Humidity measurement
• 6.1.3 Surface acoustic wave devices
• 6.1.4 Light modulation
• 6.1.5 Piezoelectric actuators
• 6.2 Ultrasonic systems
• 6.2.1 Sources
• 6.2.2 Coupling of the source
• 6.2.3 Receivers
• 6.2.4 Ultrasonic flow measurement
• 6.2.5 Ultrasonic distance measurement
• 6.2.6 Ultrasonic measurement using variation in transmission velocity
• 6.2.7 Ultrasonic imaging
• 7 Interference and noise in measurement
• 7.1 Interference
• 7.1.1 Common mode rejection ratio
• 7.1.2 Ground or earth loops
• 7.1.3 Electrostatic interference: screening and guarding
• 7.1.4 Electromagnetic interference
• 7.1.5 Power supplies as a source of interference
• 7.2 Noise
• 7.2.1 White and coloured noise
• 7.2.2 Sources of noise
• 7.2.3 Noise factor
• 7.2.4 Signal-to-noise ratio
• 8 Signal processing
• 8.1 Operational amplifiers
• 8.1.1 Integrator
• 8.1.2 Buffer amplifier
• 8.1.3 Current to voltage converter
• 8.1.4 Voltage to current converter
• 8.1.5 Logarithmic amplifier
• 8.1.6 Charge amplifier
• 8.1.7 Differential amplifier
• 8.1.8 Comparator
• 8.1.9 Schmitt trigger amplifier
• 8.2 Practical operational amplifiers
• 8.2.1 Amplifier errors
• 8.2.2 Chopper stabilized amplifiers
• 8.2.3 Auto-zeroing amplifier
• 8.3 Signal isolation
• 8.3.1 Isolation amplifier
• 8.3.2 Opto-isolation
• 8.3.3 Transformer isolation
• 8.4 Phase sensitive detector
• 8.4.1 Phase locked loop
• 8.5 Multiplexing
• 8.5.1 Time division multiplexing
• 8.5.2 Frequency division multiplexing
• 8.6 Filters
• 8.6.1 Analogue filters
• 8.6.2 Digital filters: the sampling theorem
• 8.6.3 Pre-processing and post-processing filters
• 8.7 Digital signal processing
• 8.7.1 Analogue to digital and digital to analogue conversion
• 8.7.2 Signal analysis
• 8.8 Smart sensors
• 8.9 Expert systems, artificial intelligence and measurement
• Part Two Embedded Microprocessor Systems
• 9 Microprocessors in mechatronic systems
• 9.1 Embedded real-time microprocessor systems
• 9.2 The mechatronic system
• 10 The microprocessor system
• 10.1 The system components
• 10.2 The system bus
• 10.3 The memory map
• 10.4 The microprocessor bus operation
• 11 The central processing unit
• 11.1 CPU operation: the fetch phase
• 11.1.1 The program counter
• 11.1.2 The stack pointer
• 11.1.3 Instruction decode and control
• 11.1.4 Microcoded instruction decode and control
• 11.1.5 Hard wired control units
• 11.2 CPU operation: the execution phase
• 11.2.1 The arithmetic and logic unit and the accumulator
• 11.2.2 The processor status register
• 11.2.3 The register bank
• 11.3 Interrupt processing
• 11.3.1 Register stacking and context switching
• 11.3.2 Systems with multiple interrupt sources
• 11.3.3 Non-vectored interrupts
• 11.3.4 Vectored interrupts
• 11.3.5 Multiple interrupt processing
• 11.3.6 Non-maskable interrupts and CPU reset
• 11.4 The central processor unit instruction set
• 11.5 Addressing modes
• 11.5.1 Immediate addressing
• 11.5.2 Direct addressing
• 11.5.3 Paged addressing
• 11.5.4 Indirect addressing
• 11.5.5 Indexed addressing
• 11.5.6 Relative addressing
• 11.5.7 Stack addressing
• 11.6 CISC and RISC instruction sets
• 12 Semiconductor memory, input and output, and peripheral circuits
• 12.1 Semiconductor memory devices
• 12.1.1 Read only memory
• 12.1.2 Read/write memories
• 12.2 Input and output devices
• 12.2.1 Parallel I/O
• 12.2.2 Interrupt support
• 12.2.3 Data transfer using handshaking
• 12.2.4 Serial I/O
• 12.2.5 Analogue to digital and digital to analogue converters
• 12.3 Peripheral circuits
• 12.3.1 Programmable counter/timers
• 12.3.2 Direct memory access
• 12.3.3 Interrupt controllers
• 12.4 Coprocessors
• 12.5 Microprocessor types
• 12.5.1 Microcontrollers
• 12.5.2 Example: the National Semiconductor HPC16083 microcontroller
• 12.5.3 Digital signal processors
• 13 Semi-custom devices, programmable logic and device technology
• 13.1 Application specific integrated circuits
• 13.1.1 Gate arrays
• 13.1.2 Standard cell and functional block ASICs
• 13.1.3 Analogue ASICs
• 13.2 Programmable logic devices
• 13.2.1 The programmable read only memory
• 13.2.2 The programmable logic array
• 13.2.3 Programmable array logic
• 13.2.4 Programming and reprogramming programmable logic devices
• 13.3 Semiconductor technologies
• 13.3.1 Some important characteristics
• 13.3.2 MOS technologies
• 13.3.3 Bipolar technologies
• 14 The development of microprocessor systems
• 14.1 The system specification
• 14.2 The development environment
• 14.3 The development cycle
• 14.3.1 The editor: entering the source program
• 14.3.2 Compilation and assembly: the generation of object code
• 14.3.3 Linking: relocatable and absolute object code
• 14.3.4 Object code libraries
• 14.3.5 Emulation and debugging
• 14.4 Assemblers, linkers and assembly language
• 14.4.1 An assembler program example
• 14.5 High level programming languages and compilers
• 14.6 The real-time multitasking executive
• 14.6.1 Tasks and task scheduling
• 14.6.2 Intertask communications and synchronization
• 14.6.3 Timing
• 14.6.4 Memory manager
• 14.6.5 An application example
• 15 Communications
• 15.1 Control and communication system hierarchies
• 15.2 Local area networks
• 15.2.1 Standards and the communication system reference model
• 15.2.2 LAN standards
• 15.2.3 LAN topology
• 15.2.4 LAN frame structure and medium access techniques
• 15.3 A communications system hierarchy for industrial automation applications
• 15.3.1 The manufacturing automation protocol
• 15.3.2 The enhanced performance architecture (EPA) MAP
• 15.3.3 Fieldbus
• Part Three Motion Control
• 16 Drives and Actuators
• 17 Control devices
• 17.1 Electrohydraulic control devices
• 17.1.1 Flapper controlled electrohydraulic servovalve
• 17.1.2 Proportional solenoid Controlled Electrodynamic Value
• 17.1.3 Simple flapper orifice
• 17.2 Electropneumatic proportional controls
• 17.2.1 Direct proportional controls for pressure and flow
• 17.2.2 Pulse width modulation control of solenoid valves
• 17.3 Control of electrical drives: power semiconductor devices
• 17.3.1 Diodes
• 17.3.2 Thyristors
• 17.3.3 Gate turn-off thyristors
• 17.3.4 Triacs
• 17.3.5 Power transistors
• 17.3.6 Power MOSFETs
• 17.3.7 Insulated gate bipolar transistors
• 17.3.8 Smart power devices
• 17.3.9 Heat transfer and cooling
• 17.3.10 Protection
• 17.4 Converters, choppers, inverters and cycloconverters
• 17.4.1 Naturally commutated thyristor converters
• 17.4.2 DC choppers
• 17.4.3 Inverters
• 17.4.4 Cycloconverters
• 18 Linear systems
• 18.1 Pneumatic rams: rod type
• 18.2 Pneumatic rams: rodless type
• 18.3 Pneumatic diaphragms
• 18.4 Pneumatic bellows
• 18.5 Hydraulic cylinders
• 18.6 Motor and ball screw
• 18.7 Motor and leadscrew
• 18.8 Direct linear electrical actuators
• 18.9 Solenoids
• 18.10 Other forms of electrical actuator
• 19 Rotational drives
• 19.1 Pneumatic motors: continuous rotation
• 19.2 Pneumatic motors: limited rotation
• 19.3 Hydraulic motors: continuous rotation
• 19.3.1 Gear motors
• 19.3.2 Vane motors
• 19.3.3 Axial piston motors
• 19.3.4 Radial piston motors
• 19.3.5 General characteristics of rotational hydraulic transmissions
• 19.4 Hydraulic motors: limited rotation
• 19.5 Electrical motors
• 19.5.1 DC machines
• 19.5.2 DC variable speed drives
• 19.5.3 DC servomotors
• 19.5.4 Induction machines
• 19.5.5 AC variable speed drives
• 19.5.6 Stepper motors
• 19.5.7 Synchronous machines
• 19.5.8 Brushless machines
• 19.5.9 Switched reluctance motors
• 19.5.10 Toroidal torque motor
• 19.5.11 Electrical variable speed drive characteristics
• 20 Motion converters
• 20.1 Fixed ratio motion converters
• 20.1.1 Parallel shaft gears
• 20.1.2 Epicyclic gears
• 20.1.3 Harmonic drives
• 20.1.4 Worm and bevel gears
• 20.1.5 V belt drives
• 20.1.6 Toothed belt drivers
• 20.1.7 Chains and sprockets
• 20.1.8 Friction wire wrap drives
• 20.1.9 Rack and pinion
• 20.1.10 Screw nut systems
• 20.2 Motion converters with invariant motion profile
• 20.2.1 Cams
• 20.2.2 Indexing mechanisms
• 20.2.3 Linkages
• 20.2.4 Springs and dampers
• 20.3 Variators (continuously variable transmissions)
• 20.3.1 Conical pulley/disc systems
• 20.3.2 Ball/disc friction drive systems
• 20.3.3 Unit hydraulic transmissions
• 20.4 Remotely controlled couplings
• Part Four Case Studies
• 21 Mechanical systems and design
• 21.1 Tradition versus mechatronics
• 21.2 The mechatronic approach
• 21.2.1 Replacement of mechanisms
• 21.2.2 Simplification of mechanisms
• 21.2.3 Enhancement of mechanisms
• 21.2.4 Synthesis of mechanisms
• 21.3 Control
• 21.3.1 Program control
• 21.3.2 Adaptive control
• 21.3.3 Distributed systems
• 21.4 The design process
• 21.4.1 Need
• 21.4.2 Feasibility
• 21.4.3 Specification
• 21.4.4 Conceptual design
• 21.4.5 Analysis and modelling
• 21.4.6 Embodiment and optimization
• 21.4.7 Detail design
• 21.5 Types of design
• 21.6 Integrated product design
• 21.6.1 Project management
• 21.6.2 Planning and implementation of facilities
• 22 Mechanisms
• 22.1 Load conditions
• 22.1.1 Actuator requirements
• 22.1.2 Attaining partial static balance
• 22.1.3 Articulation requirements
• 22.1.4 Speed versus accuracy
• 22.1.5 Minimization of kinetic energy
• 22.1.6 Power transmission over a distance
• 22.1.7 Effects of assembly play and friction
• 22.1.8 Inertia
• 22.2 Design
• 22.2.1 Materials
• 22.2.2 Sizing of actuators
• 22.3 Flexibility
• 22.3.1 Resilience
• 22.3.2 Backlash
• 22.3.3 Vibration
• 22.4 Modelling and simulation
• 22.4.1 GRASP
• 22.4.2 ADAMS/DRAMS
• 23 Structures
• 23.1 Load conditions
• 23.1.1 Static loading
• 23.1.2 Dynamic and cyclic loading
• 23.1.3 Impulse and shock loading
• 23.2 Flexibility
• 23.2.1 Flexible structures
• 23.2.2 Vibration effects
• 23.2.3 Materials
• 23.3 Environmental isolation
• 23.4 Modelling
• 23.5 Systems
• 24 Man-machine interface
• 24.1 Industrial design and ergonomics
• 24.1.1 Aesthetics and style
• 24.1.2 Ergonomics
• 24.2 Information transfer: from machine to man
• 24.2.1 Human responses to stimuli
• 24.3 Information transfer: from man to machine
• 24.4 Safety
• 24.4.1 Operator safety
• 24.4.2 System safety
• Part Five Case Studies
• 25 Introduction to case studies
• 26 Canon EOS autofocus cameras
• 26.1 Main microprocessor
• 26.2 Exposure control
• 26.2.1 Diaphragm drive system
• 26.3 Autofocus
• 26.3.1 The BASIS sensor
• 26.3.2 Depth of field setting
• 26.3.3 Focusing drives
• 26.4 Lens microprocessor
• 26.5 Film transport system
• 27 Fly-by-wire
• 27.1 The EAP systems architecture and flight control system
• 27.2 The flight control computers
• 27.3 MIL-STD-1553: a digital data transmission system for military applications
• 28 British aerospace small parts flexible manufacturing system
• 28.1 Billet preparation
• 28.2 Steel and titanium parts
• 28.3 Aluminium parts
• 28.4 Control
• 29 Autohelm 800 boat autopilot
• Appendix A Definitions and terminology
• Appendix B Inertial loads
• B.1 Tangentially driven loads
• B.1.1 Systems with a ratio change
• B.2 Leadscrew driven loads
• Bibliography
• Index